| 摘要 |
<p>Metallised support based on polymethylpentene and process for the manufacture of this support. This support comprises at least one layer (2) of poly(4-methyl-1-pentene) or PMP, whose thickness is greater than 100 micrometres and at least one of whose two faces is covered, at least partially, with a metal layer (4, 6). To produce such a support, a metal layer is plated with heating, by pressing or laminating, at a temperature at least equal to the melting temperature of the PMP employed, onto a layer of PMP (of slightly greater thickness than that which it is intended to obtain once the metallisation is finished), after a surface treatment of these layers has been carried out, which is capable of promoting their adhesiveness. Application to the production of very high frequency electronic circuits and planar aerials. <IMAGE></p> |
