LEAD MOUNTING STRUCTURE FOR ELECTRONIC DEVICE

摘要

PURPOSE:To rigidly connect a lead to the surface of a metallized layer at the periphery through a brazing material by providing a gap between the lower surface of the lead and the surface of the layer for connecting the lead, and sufficiently circulating the material for connecting the lead to the gap. CONSTITUTION:A fine stripelike protrusion 40 is laterally provided on an midway of the part for connecting a lead 30 of the surface of a metallized layer 10. The lead 30 is placed on the layer 10 in a state that the midway of the lead 30 made of metal is placed on the protrusion 40 of the midway of the layer 10. A brazing material 50 is sufficiently circulated to a gap 60 between the lower surface of the lead 30 and the surface of the layer 10 directly under it to fully adhere the material 50 such as silver brazing material, solder, etc., to the lead 30 and the layer 10 base-plated at the periphery. The lead 30 is rigidly connected to the surface of the layer 10.