| 摘要 |
PURPOSE:To enhance yield in forming a reticle high in dimensional precision by exposing the same device pattern in plural positions of one substrate coated with a resist in stepwise changed exposure amounts. CONSTITUTION:After the exposure position is set in accordance with one frame 4a, it is exposed to light having a device pattern 3a, next, the substrate 2 is moved to set the exposure position and it is exposed in an exposure amount set to another to light having a device pattern 3b, and in other frames 4c and 4d, device patterns 3c and 3d are exposed by exposing in the stepwise changed exposure amounts. After finishing the exposures, the reticle 1 is completed by carrying out successive works of development, etching, rinsing, and the like. The exposure amounts are indicated so as to form the patterns having the size, that is, the line widths larger than the designed value and smaller than it, thus permitting the reticles high in dimensional precision to be formed in an extremely high yield. |
