| 摘要 |
PURPOSE:To instantaneously harden an anisotropically conductive material, to prevent the viscosity of an adhesive from being dropped suddenly and to prevent air bubbles from being generated in a connecting part by a method wherein conductive particles are resin dispersed into an electron-beam hardening type insulating adhesive resin, they are compression-bonded to a bonding region at a mounting operation and, after that, they are irradiated with an electron beam. CONSTITUTION:The surface of an electrode pad 4 for an IC chip 3 is cleaned; the surface of the IC chip 3 including the electrode pad 4 is coated with an anisotropically conductive material whose conductive particles 1 have been dispersed into an electron- beam hardening type insulating adhesive resin 2. In addition, the surface including an electrode terminal 6 of a glass substrate 5 is coated with the adhesive resin 2 containing the conductive particles 1. Then, the electrode pad 4 is faced with the electrode terminal 6; the IC chip 3 is placed on the glass substrate 5; a load is exerted; and the IC chip 3 is pressed down; the electrode pad 4 is compression-bonded to the electrode terminal 6. At the same time, an electron beam 7 is applied from the transverse direction and from the rear direction of the glass substrate 5; the resin 2 applied between the IC chip 3 and the glass substrate 5 is hardened; and the IC chip 3 is bonded to the glass substrate 5. |
