发明名称 |
TAB TAPE FOR HIGH FREQUENCY SEMICONDUCTOR DEVICE |
摘要 |
A TAB tape or tape-like carrier used for an automatic bonding process when manufacturing high-frequency semiconductor devices has a plurality of electrically conductive circuit patterns on a flexible insulative film having a plurality of holes located in gaps between adjacent circuit pattterns. A ground layer is formed on a back surface of the insulative film, and electrically conductive layers or material are formed on inner peripherals walls of the holes or filled in the holes, so that the ground layer is electrically connected to the respective conductive layers or material. |
申请公布号 |
KR930002515(B1) |
申请公布日期 |
1993.04.03 |
申请号 |
KR19890017850 |
申请日期 |
1989.12.04 |
申请人 |
SHINKO ELECTRIC CO., LTD. |
发明人 |
WADA, NORIO;FUKASE, KATSUYA;UCHITA, HIROFUMI |
分类号 |
H01L21/60;H01L21/027;H01L21/30;H01L23/495;H05K1/02;(IPC1-7):H01L21/28 |
主分类号 |
H01L21/60 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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