| 发明名称 |
SEMICONDUCTOR DEVICE ENCAPSULANT |
| 摘要 |
<p>A semiconductor device encapsulant contains (a) a thermosetting resin for providing a cured product having a glass transition temperature of not less than 190 DEG C, (b) a filler consisting of a fused silica, (c) a modifier consisting of an MBS or ABS, (d) a modifier consisting of a silicone rubber or a silicone gel, and (e) a lubricant containing a metal chelate compound.</p> |
| 申请公布号 |
KR930002803(B1) |
申请公布日期 |
1993.04.10 |
| 申请号 |
KR19900002342 |
申请日期 |
1990.02.23 |
| 申请人 |
TOSHIBA CO., LTD. |
发明人 |
UCHIDA, KEN;FUJIEDA, SHINETSU;HIKASHI, MICHIYA;SHIMOJAWA, HIROSHI;YOSHITSUMI, AKIWA |
| 分类号 |
C08K3/36;C08G59/00;C08G59/40;C08K5/56;C08L63/00;C08L79/08;H01L23/29;H01L23/31;(IPC1-7):H01L23/29 |
主分类号 |
C08K3/36 |
| 代理机构 |
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代理人 |
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