ENCAPSULATED DIES WITH ENHANCED THERMAL PERFORMANCE

摘要

The present disclosure relates to enhancing the thermal performance of encapsulated flip chip dies. According to an exemplary process, a plurality of flip chip dies are attached on a top surface of a carrier, and a first mold compound is applied over the top surface of the carrier to encapsulate the plurality of flip chip dies. The first mold compound is thinned down to expose a substrate of each flip chip die and the substrate of each flip chip die is then substantially etched away to provide an etched flip chip die that has an exposed surface at the bottom of a cavity. Next, a second mold compound with high thermal conductivity is applied to substantially fill each cavity and the top surface of the second mold compound is planarized. Finally, the encapsulated etched flip chip dies can be marked, singulated, and tested as a module.

主权项

1. A method comprising:
attaching a plurality of flip chip dies on a top surface of a carrier; applying a first mold compound over the top surface of the carrier to encapsulate the plurality of flip chip dies; thinning the first mold compound down to expose substrates of the plurality of flip chip dies; etching away substantially the entire substrate of each of the plurality of flip chip dies with an etchant to provide an etched flip chip die that has an exposed surface at the bottom of a cavity; and applying a second mold compound to substantially fill each cavity and directly contact the exposed surface of each etched flip chip die.