发明名称 WAFER FIXING MECHANISM
摘要 <p>PURPOSE:To support especially the outer circumferential face of a wafer and to fix the wafer regarding a wafer fixing mechanism which alternately fixes and releases the wafer. CONSTITUTION:A disk-shaped pivoting member 22 whose center is connected to a support plate 21 on its flat surface side and which is pivoted freely in the direction parallel to the surface of the support plate 21 is connected to at least three connection members 23a, 23b, 23c,... whose end parts, on one side, separated form each other in the circumferential direction of the pivoting member to the pivoting member have been connected to the pivoting member so as to be capable of being pivoted freely in such a way that the end parts on one side can be pivoted freely on the surface of the support plate. In addition, a wafer fixing mechanism is constituted so as to include pressure members 24a, 24b, 24c,... which are connected to end parts, on the other side, of the connection members 23a, 23b, 23c,... so as to be capable of being pivoted freely in such a way that their intermediate parts correspond in a one-to-one manner and a drive means 25 which is connected to one out of the pressure members and which pivots the connected pressure member to a direction parallel to the surface of the support plate 21 at an arbitrary angle and to the direction of the pivoting member 22.</p>
申请公布号 JPH0669320(A) 申请公布日期 1994.03.11
申请号 JP19910062917 申请日期 1991.03.27
申请人 FUJITSU LTD;FUJITSU VLSI LTD 发明人 KISHI AKIHIRO
分类号 B23Q3/06;H01L21/68;(IPC1-7):H01L21/68 主分类号 B23Q3/06
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