SEMICONDUCTOR DEVICE USING FILM CARRIER

摘要

The film carrier comprises a resin film (110) with an opening (112) receiving the semiconductor chip, its surface supporting lead wires (134), each having an inner, intermediate and outer sections. The inner sections of the lead wires are connected to the respective chip terminals. Their outer sections are connected to respective external electrodes (130) and lie in the same plane as the latter. Pref. the resin film (110) is stiffened by a metal film applied to it on one side. USE/ADVANTAGE - Suitable for high speed operation, typically gallium-arsenic semiconductor.