Method of providing a substrate with a surface layer from a vapour and device for implementing such a method.,申请号EP19910202494-传众专利搜索

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发明名称	Method of providing a substrate with a surface layer from a vapour and device for implementing such a method.
摘要
申请公布号	EP0479375(B1)	申请公布日期	1995.04.26
申请号	EP19910202494	申请日期	1991.09.26
申请人	PHILIPS ELECTRONICS N.V.	发明人	VISSER, JAN
分类号	C23C16/44;C23C16/448;H01L21/31;(IPC1-7):C23C16/44	主分类号	C23C16/44
代理机构		代理人
主权项
地址

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