发明名称 |
Semiconductor device and manufacturing method thereof |
摘要 |
A semiconductor device having excellent electric characteristics and a method for manufacturing the semiconductor device are provided. A method for manufacturing a semiconductor device includes the steps of: forming a gate electrode; forming a gate insulating film to cover the gate electrode; forming an oxide semiconductor film over the gate insulating film; forming a hydrogen permeable film over the oxide semiconductor film; forming a hydrogen capture film over the hydrogen permeable film; performing heat treatment to release hydrogen from the oxide semiconductor film; forming a source electrode and a drain electrode to be in contact with a part of the oxide semiconductor film; and removing an exposed portion of the hydrogen capture film to form a channel protective film formed of the hydrogen permeable film. A semiconductor device manufactured by the above method is also provided. |
申请公布号 |
US9472676(B2) |
申请公布日期 |
2016.10.18 |
申请号 |
US201213422251 |
申请日期 |
2012.03.16 |
申请人 |
Semiconductor Energy Laboratory Co., Ltd. |
发明人 |
Imoto Yuki;Maruyama Tetsunori;Endo Yuta |
分类号 |
H01L29/786;H01L27/32;H01L51/05 |
主分类号 |
H01L29/786 |
代理机构 |
Robinson Intellectual Property Law Office, P.C. |
代理人 |
Robinson Eric J.;Robinson Intellectual Property Law Office, P.C. |
主权项 |
1. A semiconductor device comprising:
a gate electrode; a gate insulating film over the gate electrode; an oxide semiconductor film over the gate insulating film; a channel protective film having a hydrogen permeable property over the oxide semiconductor film; a film having a hydrogen capture property in contact with a part of the channel protective film, a part of the oxide semiconductor film, and a part of the gate insulating film; and a source electrode and a drain electrode over and in direct contact with an upper surface of the film having a hydrogen capture property. |
地址 |
Atsugi-shi, Kanagawa-ken JP |