发明名称 |
Method for improving the adhesion of a deposited metal layer |
摘要 |
The surface of a partially manufactured integrated circuit is cleaned by successive immersions in a series of specially formulated baths. Metallic films deposited on surfaces that have been cleaned in this manner do not exhibit subsequent peeling or blistering and have low electrical contact resistance to the surface onto which they were deposited.
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申请公布号 |
US5486266(A) |
申请公布日期 |
1996.01.23 |
申请号 |
US19940299267 |
申请日期 |
1994.09.01 |
申请人 |
TAIWAN SEMICONDUCTOR MANUF. COMPANY |
发明人 |
TSAI, CHIA S.;CHANG, TIEN C. |
分类号 |
H01L21/3205;(IPC1-7):H01L21/00 |
主分类号 |
H01L21/3205 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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