| 摘要 |
FIELD: manufacture of integrated-circuit microdisplacement transducers, electronic safety systems for transport, navigation systems, and moving-object observing facilities. SUBSTANCE: transducer has sensing element in the form of cantilever placed within material of semiconductor substrate with seismic masses whose surface mounts movable plates of variable capacitor whose fixed plates are placed on surface of additional semiconductor substrate built integral with first substrate. EFFECT: improved design. 1 cl, 2 dwg |
