发明名称 Semiconductor device having Al-Cu wiring lines where Cu concentration is related to line width
摘要 A semiconductor device that includes a wiring line formed from an electrode wiring layer which uses, as an electrode material, an Al alloy containing Cu, wherein wiring line having a size smaller than a crystal grain diameter has a Cu concentration of 0.05 to 0.3 wt %, and a wiring line having a size larger than a crystal grain diameter has a Cu concentration of 0.5 to 10 wt %.
申请公布号 US5606203(A) 申请公布日期 1997.02.25
申请号 US19950481160 申请日期 1995.06.07
申请人 KABUSHIKI KAISHA TOSHIBA 发明人 EGAWA, HIDEMITSU
分类号 H01L21/3205;H01L23/532;(IPC1-7):H01L23/48 主分类号 H01L21/3205
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