发明名称 |
Micro emitter based low contact force interconnection device |
摘要 |
An interconnection device is disclosed for providing electrical connection between two conducting elements that requires less applied force than a standard ohmic connection device of the same connection area. A surface of at least a first conducting element includes a plurality of atomically sharp projections for creating a strong electric field near the tip of each projection, each projection being disposed within a locally depressed portion of an insulating layer that serves to maintain a space between each tip and a second conducting element that contacts the insulating layer. The strong electric field at each tip induces a variety of conduction modes each contributing to an aggregate current flow from the first conducting element to the second. In an alternate embodiment, a plurality of projections are disposed on the peaks and valleys of a rough surface without an insulating layer, the projections providing a variety of conduction modes.
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申请公布号 |
US5660570(A) |
申请公布日期 |
1997.08.26 |
申请号 |
US19950402140 |
申请日期 |
1995.03.10 |
申请人 |
NORTHEASTERN UNIVERSITY |
发明人 |
CHAN, CHUNG;WARNER, KEITH;CVIJANOVICH, GEORGE B. |
分类号 |
H01J1/304;H01R4/58;H01R43/16;H05K3/32;H05K3/40;(IPC1-7):H01J1/30 |
主分类号 |
H01J1/304 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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