发明名称 |
Surface layer forming apparatus using electric discharge machining |
摘要 |
An apparatus and process for forming surface layers on electrodes by electric discharge machining. A machining gap, between an electrode and a workpiece is filled with a dielectric mixture containing metallic or submetallic powder. The apparatus uses a swinging mechanism to move the electrode during processing. The apparatus uses a high-voltage superposition circuit to superpose a voltage of 100-400 V across the gap. The apparatus uses a current limiting resistor of 100-300 OMEGA to ensure that the main circuit supplies a low voltage of approximately 100 V to the machining gap. In a second embodiment, the apparatus prevents electrode cracking by dispersing the discharges throughout, and widening, the machining gap.
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申请公布号 |
US5693240(A) |
申请公布日期 |
1997.12.02 |
申请号 |
US19940360555 |
申请日期 |
1994.12.21 |
申请人 |
MITSUBISHI DENKI KABUSHIKI KAISHA;MOHRI, NAOTAKE |
发明人 |
MAGARA, TAKUJI;SAITO, NAGAO;MOHRI, NAOTAKE |
分类号 |
B23H1/00;B23H1/02;B23H1/04;B23H1/08;B23H9/00;C23C26/00;C23C26/02;(IPC1-7):B23H1/00 |
主分类号 |
B23H1/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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