| 发明名称 |
Single chamber sputtering assembly |
| 摘要 |
A sputtering assembly for use in forming sputter deposited layers on a substrate is described. The assembly includes a pair of confronting sputtering targets for depositing sputtered layers onto the substrate and a movably mounted heating means for heating the substrate. A method of using the assembly is also disclosed.
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| 申请公布号 |
US5693199(A) |
申请公布日期 |
1997.12.02 |
| 申请号 |
US19960685694 |
申请日期 |
1996.07.24 |
| 申请人 |
HMT TECHNOLOGY CORPORATION |
发明人 |
BOUREZ, ALLEN J.;LAL, BRIJ BIHARI;RUSSAK, MICHAEL A. |
| 分类号 |
C23C14/34;C23C14/35;G11B5/851;H01J37/34;(IPC1-7):C23C14/34 |
主分类号 |
C23C14/34 |
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