发明名称 |
Method of manufacturing a semiconductor device suitable for surface mounting |
摘要 |
A method of manufacturing a semiconductor device suitable for surface mounting whereby semiconductor elements are interconnected into a coherent row of semiconductor elements by means of conductive strips such that a connection point of a certain semiconductor element is connected to a connection point of a semiconductor element preceding it in the row by means of a strip, and another connection point of said certain semiconductor element is connected to a connection point of a semiconductor element following it in the row, and the row of semiconductor elements is enveloped in a protective material, and the semiconductor elements are mutually separated into individual semiconductor devices provided with two side faces, each side face having a portion of the strip which is processed into a connection conductor in that an electrically conducting layer is provided on the side faces contacting said portion of the strip.
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申请公布号 |
US5712197(A) |
申请公布日期 |
1998.01.27 |
申请号 |
US19960645436 |
申请日期 |
1996.05.13 |
申请人 |
U.S. PHILIPS CORPORATION |
发明人 |
SANDERS, KLAASTINUS H.;DUINKERKEN, GEERT J. |
分类号 |
H01L21/56;H01L21/78;H01L23/31;H01L23/48;H01L23/495;H04N7/01;(IPC1-7):H01L21/60 |
主分类号 |
H01L21/56 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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