| 摘要 |
<p>The present invention relates to a method for mounting a component at a specific position, specifically a chip component on a substrate such as a printed circuit board comprising the steps of picking up the component through a pick-up nozzle from a component supply unit, transferring the component and placing same in a detection area of an optical detecting means for detecting a deviation of the component being picked up from a predetermined component position relative to the pick-up nozzle and mounting the component at the desired position. Moreover the present invention relates to a mounting device for mounting a component at a specific position comprising a movable mounting head unit supporting at least one pick-up nozzle for picking up at least one component from a component supply unit, a position detecting means for detecting a deviation of the picked up component from a predetermined position relative to the pick-up nozzle and correction value calculating means for calculating correction values for correcting a predetermined mounting position of the pick-up nozzle in response to said deviation. The method is improved by the step of changing the predetermined pick up position of the pick-up nozzle for the component to be picked up next in response to said deviation detected. Accordingly the mounting device is improved in that a pick up point changing means is provided for changing the predetermined pick up point of the pick-up nozzle in response to said correction values. <IMAGE></p> |
