首页
产品
黄页
商标
征信
会员服务
注册
登录
全部
|
企业名
|
法人/股东/高管
|
品牌/产品
|
地址
|
经营范围
发明名称
BONDING DEVICE FOR CHIP WITH BUMP
摘要
申请公布号
JPH10321673(A)
申请公布日期
1998.12.04
申请号
JP19970132076
申请日期
1997.05.22
申请人
MATSUSHITA ELECTRIC IND CO LTD
发明人
ONIZUKA YASUTO
分类号
H01L21/60;(IPC1-7):H01L21/60
主分类号
H01L21/60
代理机构
代理人
主权项
地址
您可能感兴趣的专利
Cloned glutamic acid decarboxylase nucleic acids
Programmable switch for FPGA input/output signals
System and method for overriding a low marking material status in a facsimile environment
Semiconductor device
Fluorosiloxane-containing care compositions
Frequency converter device which adaptively responds to a power failure
Asymmetric speech coding for a digital cellular communications system
Semiconductor memory device having a redundant memory cell
Laser optical torquemeter
TAKE UP UNIT FOR TENSIONING MEANS
METHOD FOR DETECTING ANALYTE IN SAMPLE LIQUID, REAGENT KIT AND REACTION VESSEL
POWER SUPPLY UNIT
INFORMATION RECORDER
WINDING STRUCTURE OF ROLL PAPER
SEMICONDUCTOR INTEGRATED CIRCUIT
COMPUTER SYSTEM
INSERTING AND EJECTING DEVICE OF RECORDER FOR SELECTIVELY ACCEPTING VARIOUS TYPES CASSETTE
METHOD AND SYSTEM FOR PRINT
DUPLEX SYSTEM FOR COMMON MEMORY
INTER-BUS CONNECTION SYSTEM
