| 摘要 |
PURPOSE:To facilitate connection with a semiconductor chip by lapping a heat sink on a inner lead wire on the peripheral edge and electrically insulating the connection between the heat sink and the inner lead wire and forming a projected part for connecting a semiconductor chip. CONSTITUTION:A heat sink 25 is connected with the top and the bottom of an inner lead 22 on the peripheral edge by way of a bonding agent 26 having electrically insulating properties. A projected part 27 whose top is virtually flush with the top of the inner lead wires 22, is formed in a space surrounded by the tip of the inner lead wires 22 on the top of the heat sink 25. In a semiconductor device 30, a semiconductor chip 31 is fixedly mounted to the top of the projected part 27 of the heat sink 25 by means of a bonding agent 32 having insulating properties in such a manner that the chip side where there exists a junction pattern may be directed to the top of the projected part 27. Furthermore, the semiconductor chip 31 is electrically connected with the inner lead wires 22 and a TAB lead wire 31. |
