发明名称 Laser shock processing method utilizing light absorbing material layer of controlled thickness
摘要 <p>A laser shock processing method for evaporating a light absorbing material (112) by irradiation of laser light and for applying a shock to a metallic workpiece (111) by utilizing an increase in pressure due to evaporation of the light absorbing material, comprises the steps of: mounting a light absorbing film (112), which is formed in such a manner as to have a predetermined thickness and is made of a light absorbing material for absorbing laser light, on a surface of the metallic workpiece (111); mounting a light transmitting member (113) on the light absorbing film (112); and irradiating the light absorbing film with a laser light pulse through the light transmitting member, wherein the absorbing film (112) is wound on a reel (115) in such a manner that it can be unwound therefrom if necessary. &lt;IMAGE&gt;</p>
申请公布号 EP0964067(A1) 申请公布日期 1999.12.15
申请号 EP19990115755 申请日期 1994.12.06
申请人 TOYOTA JIDOSHA KABUSHIKI KAISHA 发明人 TAKAYANAGI, NOBORU
分类号 B23K26/18;C21D10/00;C23C4/12;C23C4/18;(IPC1-7):C21D10/00 主分类号 B23K26/18
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