| 摘要 |
PROBLEM TO BE SOLVED: To provide a reliable, low-cost printed wiring board having electrodes for BGA connection over through-holes, and a method for its manufacture. SOLUTION: This method for the manufacture of the printed wiring board comprises a process, in which through-holes 4 are formed in an insulating substrate 1 with a copper foil 3 on one side, a process in which the copper foil 3 is etched to form a conductive circuit 5, a process in which solder resist 6 is formed on the conductive circuit 5 except for the regions around the through-holes 4, a process in which the through-holes 4 are filled with a conductive resin 2 for forming projections 2a of the conductive resin 2 over the through-holes 4, a process in which the conductive resin-applied face of the insulating substrate is polished and smoothed mechanically, a process in which the solder resist 6 is removed from specified places to form pads 7 for mounting, and a process in which a plate film 8 is formed on the pads 7 for mounting and a plate film 8 is formed on the surfaces of the projections 2a at the same time as well to form electrodes 9 for BGA connection.
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