Film for flexible printed wiring board

摘要

The present invention provides a film (6) for flexible printed wiring board, constituted by a plastic film (4) and an adhesive layer (5) formed thereon, the adhesive layer (5) being made of a composition of a polycarbodiimide resin and an epoxy resin or a composition of a polycarbodiimide resin, an epoxy resin and a curing agent for epoxy resin. The film for flexible printed wiring board alleviates the problems of the prior art and is characterized by enabling preliminary adhesion at relatively low temperatures, being low in dielectric constant after hot pressing, and showing superior adhesivity and heat resistance. <IMAGE>