| 摘要 |
PROBLEM TO BE SOLVED: To reduce a cost required in designing, manufacturing and managing a tray by reducing the number of types of trays and to prevent contamination of a bump electrode on a lower face of a housed package. SOLUTION: A plurality of package housings 6 on a substrate 4 are structured such that storage spaces 602, 604, 606, 608 having different opening sizes are succeedingly provided in a plurality of stages from an upper face side of the substrate 4 in a descending sequence of the opening sizes, while a bottom face 6022 of an upper layer storage space supports regions 10S2, 10S3 without electrodes attached on a lower face of an IC package 10 to be housed, between vertically adjacent storage spaces. Further, longitudinal, lateral and depth sizes of the respective storage spaces 602, 604, 606, 608 are specified so that a bump electrode 1004 made to protrude on a bump electrode formed region 10S1 on the lower face of the IC package 10 is housed in a lower layer storage space without contact.
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