| 摘要 |
PROBLEM TO BE SOLVED: To obtain the subject polycarbodiimide having a high solubility in organic solvents, good in processability and having excellent heat and moisture resistances, or the like, by polymerizing a specific diisocyanate monomer. SOLUTION: (A) A diisocyanate monomer represented by formula I (Xs are each a halogen) is used as a monomer and polymerized in the presence of (B) a phosphorus-based catalyst (e.g. 1-phenyl-2-phospholene-1-oxide) preferably at 40-150 deg.C to thereby afford an aromatic polycarbodiimide having a constitutional unit represented by formula II [(n) is 2-300]. In the above polymerization, the concentration of the component A is preferably 2-70 wt.%. A molded product prepared by molding the polycarbodiimide into a filmy form can be used as a heat-resistant bonding sheet and is useful for especially a fixing treatment for electrical and electronic parts such as semiconductor chips or lead frames requiring the fixing treatment of high reliability and further low hygroscopicity.
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