| 摘要 |
PROBLEM TO BE SOLVED: To provide a thin film wiring having a lower resistance, in a high melting point metal film excellent in corrosion resistance, heat resistance and adhesion to a substrate required for a thin film wiring. SOLUTION: In this thin film wiring for electronic components, a metal film having a crystal structure of body-contered cubic system is formed on a substrate. In the thin film wiring, the ratio (110)/(200) of the (100) diffraction intensity to the (200) diffraction intensity obtained by measuring the wiring by X-ray diffraction is below 20, preferably, below 10. Thereby, the thin film wiring for electronic components can have a low resistance value necessary for the thin film wiring.
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