CURING ACCELERATOR FOR EPOXY RESIN, AND SEMICONDUCTOR SEALING MATERIAL AND SEMICONDUCTOR DEVICE USING THE SAME

摘要

PROBLEM TO BE SOLVED: To provide a curing accelerator which enables an epoxy resin to impart an excellent curability and self stability, and to provide an epoxy resin semiconductor sealing material and a semiconducor device using the same. SOLUTION: The cure accelerator for the epoxy resin comprises a compound represented by general formula (1), the compound being obtained by reacting an organophosphine, a tertiary boron compound and a compound having at least one oxirane ring or thiirane ring in a molecule.