| 摘要 |
PROBLEM TO BE SOLVED: To set the projecting positions of outer leads to desired ones in a TCP without being restricted by the arrangement positions of bonding pads on a semiconductor pellet. SOLUTION: In a TAB tape 10, a plurality of ladder-like supporting sections 11d are so installed as to cross a device hole 11a formed at a place where the semiconductor pellet 20 is mounted, Inner lead sections 12a of a lead pattern 12 which are connected to the bonding pads 21 of the semiconductor pellet 20 are arranged in an inside region of the outline of the semiconductor pellet 20 above the ladder-like supporting sections 11d, whereas outer lead sections 12b are allowed to collectively project from one side of the semiconductor pellet 20 crossing the sides where two rows of the bonding pads 21 are arranged, Due to this structure, a free design is available which allows the outer lead sections 12b to be extracted from any side of the semiconductor pellet 20 regardless of the arrangement condition of the bonding pads 21 on the semiconductor pellet 20.
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