PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME

摘要

Provided is a package structure including a circuit board, a plurality of first contact pads, a plurality of metal pillars and at least one chip. The first contact pads are disposed on the circuit board. The chip is disposed on one portion of the first contact pads. The metal pillars are disposed on the other portion of the first contact pads, where the chip is surrounded by the metal pillars. A method for manufacturing the package structure is also provided.

主权项

1. A package structure, comprising:
a circuit board, wherein the circuit board comprises a build-up structure, second contact pads and a solder mask layer, and the second contact pads are disposed between the build-up structure and the solder mask layer; a supporting structure, disposed in the circuit board, wherein the supporting structure comprises a vertical supporting structure; a first heat dissipation structure, disposed in the circuit board and between the build-up structure and the second contact pads, wherein the first heat dissipation structure is electrically connected to the vertical supporting structure to form an inverted U-shape structure; a plurality of first contact pads, disposed on the circuit board; at least one chip, disposed on one portion of the first contact pads; and a plurality of metal pillars, disposed on the other portion of the first contact pads, wherein the metal pillars surround the chip.