SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SAME

摘要

A semiconductor device includes a metal member, a semiconductor element, a resin part, a primer layer, and a peel-off restraining part. The metal member has a surface that includes a semiconductor element mounting region and a resin close contact region that extends from the semiconductor element mounting region to an outer peripheral edge of the metal member. The semiconductor element is mounted on the semiconductor element mounting region. The resin part extends to a position outside a side surface of the metal member, and closely contacts with the resin close contact region, and collectively covers the semiconductor element and the metal member. The primer layer is disposed between the resin close contact region and the resin part. The peel-off restraining part is configured to restrain the metal member and the resin part from peeling from each other in the outer peripheral part of the resin close contact region.

主权项

1. A semiconductor device comprising:
a metal member that has a surface that includes a semiconductor element mounting region and a resin close contact region, the resin close contact region extending from the semiconductor element mounting region to an outer peripheral edge of the metal member; a semiconductor element mounted on the semiconductor element mounting region; a resin part that extends to a position outside a side surface of the metal member, closely contacts with the resin close contact region, and collectively covers the semiconductor element and the metal member; a primer layer disposed between the resin close contact region and the resin part; and a peel-off restraining part configured to restrain the metal member and the resin part from peeling, due to moisture absorption of the resin part, from each other in an outer peripheral part of the resin close contact region.