| 摘要 |
PROBLEM TO BE SOLVED: To obtain a double-sided packaging structure body that packages an electronic component on both surfaces of a circuit board using a sealing resin and can improve a production yield and reliability. SOLUTION: A salient electrode 2 is formed on an IC substrate 1 by a known method as a semiconductor device. The flip-chip packaging of the semiconductor device is made onto a circuit board 4 by the known method. After a conductive adhesive 5 is cured, a sealing resin 7 whose glass transition point is approximately 90 deg.C is supplied, and is cured at 150 deg.C, thus obtaining the packaging structure body. The flip-chip packaging of the semiconductor device is made to a position that opposes the semiconductor device by the known method. After the conductive adhesive 5 is cured, a sealing resin 8 whose glass transition point is approximately 130 deg.C is supplied, and is cured at 150 deg.C, thus obtaining the double-sided packaging structure body. |
