| 摘要 |
PROBLEM TO BE SOLVED: To improve the packaging accuracy and release strength of a nickel plate to be soldered to a land. SOLUTION: In the packaging mechanism of the nickel plate 13 in a printed circuit board 1 for joining, by reflow, the nickel plate 13 that is overlapped to the land 12 being provided on a substrate via solder, the shape of the junction surface with the nickel plate 13 of the land 12 is matched to the soldering surface of the nickel plate 13, at the same time a widening part in the direction of the outside of the central part in the longitudinal direction of the land 12 is allowed to project face to face, and a fillet 5 by the adhesion of solder that flows by reflow is formed between a widening part 12a and the outer end face of the nickel plate 13.
|
