| 发明名称 |
SEMICONDUCTOR DEVICE |
| 摘要 |
According to one embodiment, a semiconductor device includes a first semiconductor chip and a second semiconductor chip. The first semiconductor chip outputs a first signal by a first bus width and includes a first via which transfers the first signal. The second semiconductor chip receives, by the first bus width, the first signal transferred through the first via. |
| 申请公布号 |
US2016351502(A1) |
申请公布日期 |
2016.12.01 |
| 申请号 |
US201514847544 |
申请日期 |
2015.09.08 |
| 申请人 |
Kabushiki Kaisha Toshiba |
发明人 |
KOUCHI Toshiyuki |
| 分类号 |
H01L23/538;H01L23/00;H01L25/065 |
主分类号 |
H01L23/538 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A semiconductor device comprising:
a first semiconductor chip which outputs a first signal by a first bus width and which includes a first via which transfers the first signal; and a second semiconductor chip which receives, by the first bus width, the first signal transferred through the first via. |
| 地址 |
Minato-ku JP |
