| 摘要 |
PROBLEM TO BE SOLVED: To form a partitioning line which clearly partitions a land group for chip parts into each other's lands so that a solder bridge or the like can be easily found by a visual inspection when the solder bridge or the like is caused on the partitioning line. SOLUTION: Conductor patterns are formed by printing on a substrate, where some conductor patterns are used for mounting a large part such as electronic part, and others, which is formed as a land group 10 for chip parts, are used for mounting small parts such as capacitors. Broad partitioning lines 15, 16,... are formed between each other's lands of 11, 12,... by silk-screen printing for the land group 10 for chip parts so that the solder bridge or the like can be easily found by the visual inspection when the solder bridge or the like is caused on the board partitioning lines 15, 16,... in a soldering process.
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