| 摘要 |
PURPOSE:To eliminate tthe need for an expensive mold by a method wherein a conducting pattern and its overlying glass layer as laid by thick-film printing without using a green sheet. CONSTITUTION:On a ceramic substrate 11 that is for example a white substrate of Al2O3, a conducting pattern 12 is formed as required, when a screen is used as required in a thick-film printing method. Baking follows. Next, on the ceramic substrate 11 and on the conducting pattern 12 formed thereon, an overlying glass layer 14 is formed of a required thickness by means of thick-film printing, with a cavity 13 left not covered for the installation of an IC chip 16. Another baking process is accomplished. Finally, a lead terminal 15 is attached by silver lead 15 to a required spot on the conducting pattern 12. |
