Electronic chip packaging

摘要

An electronic package contains a circuit card to which a chip carrier plate is attached via solder balls. A heat spreader plate, supporting a heat sink, is spring loaded against the semiconductor chip of the carrier plate by means of elastomeric disks disposed upon a spring retainer plate that is, itself, disposed adjacent the chip carrier plate. A plastic cover both protects and supports the heat sink and semiconductor chip. A retention latch is disposed between the cover plate and the spring retainer plate.