| 摘要 |
PURPOSE: To provide a method of manufacturing mask by which the shape of an aperture provided in a mask is not damaged. CONSTITUTION: The is a method of manufacturing a mask by using a substrate 110 constituted by laminating a first layer 102, a second layer 104, and a third layer 106 upon anther. The method includes a step of forming a desired opening 130 which becomes the aperture in the first layer 102, a step of wet-etching at least the area of the third layer 106 corresponding to the opening 130 so that the surface of the second layer 104 which is in contact with the third layer 106 may not be exposed, a step of dry-etching at least the area of the third layer 106 corresponding to the opening 130 so that the surface of the second layer 104 which is in contact with the third layer 106 may be exposed, and a step of removing the exposed area of the second layer 104. The substrate 110 is preferably an SOI wafer. |
