| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for forming a solder metal film even for a nonconductive micro pattern by applying electroplating. SOLUTION: A resist frame is formed on a conductor film 200 formed on a substrate 1. Solder metal films 31 and 32 are formed in the punching patterns P3 and P4 of the resist frame on the conductor film. The conductor film 200 is then etched selectively while leaving a part beneath the solder metal films 31 and 32.
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