发明名称 METHOD FOR FORMING CONDUCTIVE HOLE IN LAMINATED CHIP SHEET, LAMINATED CHIP PART AND MANUFACTURING METHOD THEREFOR
摘要 PROBLEM TO BE SOLVED: To provide a laminated chip in which there is no defective connection and defective DCR is also hardly generated and which has high reliability. SOLUTION: A site to which a through-hole is bored from the green sheet 10 side is irradiated with laser beams having a fixed diameter, a hole 12 completely penetrated to a green sheet 10 section as shown in (b) and further extending to a PET sheet 20 section is formed, a section in the vicinity of the bottom section of the through-hole of a PET sheet 20 is melted by laser beams while the periphery 21 of the hole bottom section is thermally expanded, and the bottom section of the peripheral section of the through-hole forming section of the green sheet 10 is pushed up. The green sheet 10 is melted by laser beams up to the pushed-up state. Consequently, the shape of the periphery of the through-hole of the green sheet 10 is formed approximately in a dog leg shape as shown in Fig. The screen printing of conductive paste according to a fixed conductive pattern is conducted from an upper section under the state in which the PET sheet 20 is stuck on the green sheet 10.
申请公布号 JP2002110442(A) 申请公布日期 2002.04.12
申请号 JP20000302966 申请日期 2000.10.02
申请人 KOA CORP 发明人 TANIGUCHI NORIYUKI;KAMIJO IKUMI
分类号 H01F41/04;H01F17/00;(IPC1-7):H01F41/04 主分类号 H01F41/04
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