发明名称 CHIP CAPACITOR
摘要 PROBLEM TO BE SOLVED: To improve the integrality of a capacitor body and an insulating board in the case of transport and conveyance, and to reduce mechanical stress on a lead wire after mounting a printed board. SOLUTION: The detaching of the insulating board 2 from the capacitor body 1 can be prevented surely while mechanical stress to the lead wires 3 can be reduced by engaging members 6 by pinching the insulating board by the capacitor body 1 and the engaging member 6 by penetrating through-holes formed to the insulating board 2 and bending the engaging member 6 fixed onto a mouth sealing member 4 along the underside of the insulating board.
申请公布号 JP2002110460(A) 申请公布日期 2002.04.12
申请号 JP20000297010 申请日期 2000.09.28
申请人 NIPPON CHEMICON CORP 发明人 OZAWA TADASHI
分类号 H01G9/004;H01G9/10;(IPC1-7):H01G9/004 主分类号 H01G9/004
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