| 摘要 |
PROBLEM TO BE SOLVED: To achieve downsizing of a semiconductor module which includes a plurality of parallel-connected switching elements and a signal connector.SOLUTION: A semiconductor module Ms comprises two semiconductor switching elements Q1, Q2 and a signal connector 60. The signal connector 60 includes signal pins 62, 63 for respective semiconductor switching elements Q1, Q2 which are buried in a resin platform 61 common to the two semiconductor switching elements Q1, Q2; and wire bond parts 62a, 63a of the signal pins 62, 63 for respective semiconductor switching elements Q1, Q2 which are arranged in a step-like manner. |
