发明名称 SEMICONDUCTOR PRESSURE SENSOR
摘要 PROBLEM TO BE SOLVED: To easily form an electrode for anode connection in a method for manufacturing a semiconductor pressure sensor obtained by forming a diaphragm for pressure detection on an SOI(silicone-on-insulator) substrate and anode connecting this SOI substrate to a glass pedestal. SOLUTION: A gage diffusion resistance 3 and a circuit element 4 are formed on a first silicon substrate 11, a recess part is formed on a second silicon substrate 12 for forming the diaphragm 1, and an exposure part 15 where the second silicon substrate 12 is exposed is formed by grinding at the outer periphery part of an element and diaphragm forming area on the SOI substrate 10. Via this exposure part 15, voltage is applied between the second silicone substrate 12 and the pedestal 20 to anode connect both of them.
申请公布号 JP2003031818(A) 申请公布日期 2003.01.31
申请号 JP20010211011 申请日期 2001.07.11
申请人 DENSO CORP 发明人 YOKOYAMA KENICHI;SUGIURA KAZUHIKO;KAWASAKI EIJI
分类号 G01L9/04;H01L29/84;(IPC1-7):H01L29/84 主分类号 G01L9/04
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