APPARATUS FOR PLATING LEAD FRAME AND PLATING METHOD USING THE SAME

摘要

PURPOSE: An apparatus for plating a lead frame and a plating method using the same are provided to reduce inferior semiconductor packages by restraining the thickness of a plating layer of a rail portion of a reel to reel type lead frame. CONSTITUTION: An apparatus for plating a lead frame includes a tank(110), a shield portion(120), a shield portion supporter, and a plate electrode. The tank is used for storing the plating electrolyte. The shield portion is installed in the inside of the tank and dipped into the plating electrolyte of the tank. The shield portion includes one or more couple of shield bars(121,131) having opposite grooves of different directions in order to locate a rail portion of a reel to reel type lead frame. The shield portion supporter is used for supporting the shield portion. The plate electrode is installed at a predetermined position apart from the shield portion. The plate electrode has the different polarity from the polarity of the shield portion.