| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a multilayer printed circuit board having flame retardance without use of bromine compound likely influencing harmfully on environment, realizing high tensile elongation rate of an insulation resin coat having high thermal resistance for solder capable of corresponding to lead free aspect, and mechanical and thermal resistance for stress concentration, and capable of coping with fine interconnect wiring by making surface roughness Rz 1-3μm after coarsenings. <P>SOLUTION: The multilayer printed circuit board with one side or both sides of its substrate having an internal layer circuit sequentially laminated by insulation layers and outer layer circuits includes the insulation resin layer made by hardened insulation resin composition comprising (A) epoxyide resin with biphenyl structure and novolac structure, (B) particulate matter of copolymerization object of acrylonitrile butadiene and mixture of linear polymer, (C) phosphorous included phenol resin, (D) thermosetting agent, and (E) inorganic filler. <P>COPYRIGHT: (C)2004,JPO</p> |
