发明名称 |
ELECTRONIC APPARATUS AND MANUFACTURING METHOD OF ELECTRONIC APPARATUS |
摘要 |
An electronic apparatus includes a connection target member that has a first connection portion including copper or copper alloy, a connection terminal that has a second connection portion including copper or copper alloy, the second connection portion mechanically connecting with the first connection portion by spring reaction force of the connection terminal, and a joint portion that is provided with a contact point between the first connection portion and the second connection portion. At least one of the first connection portion and the second connection portion includes an oxide film at a periphery of the joint portion on a surface thereof, the oxide film including copper oxide. The joint portion directly joints copper included in the first connection portion and copper included in the second connection portion metallurgically. |
申请公布号 |
US2016380367(A1) |
申请公布日期 |
2016.12.29 |
申请号 |
US201615163897 |
申请日期 |
2016.05.25 |
申请人 |
DENSO CORPORATION |
发明人 |
MIYAKE Toshihiro |
分类号 |
H01R12/58;H05K3/32;H05K1/11 |
主分类号 |
H01R12/58 |
代理机构 |
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代理人 |
|
主权项 |
1. An electronic apparatus comprising:
a connection target member that has a first connection portion including copper or copper alloy; a connection terminal that has a second connection portion including copper or copper alloy, the second connection portion mechanically connecting with the first connection portion by spring reaction force of the connection terminal; and a joint portion that is provided with a contact point between the first connection portion and the second connection portion, wherein: at least one of the first connection portion and the second connection portion includes an oxide film at a periphery of the joint portion on a surface thereof, the oxide film including copper oxide; and the joint portion directly joints copper included in the first connection portion and copper included in the second connection portion metallurgically. |
地址 |
Kariya-city JP |