| 摘要 |
PROBLEM TO BE SOLVED: To provide a high performance cooling device including a heat mass with at least one surface provided with as many fins as possible so as to maximize a surface area which can be used for removing wasteful heat. SOLUTION: A side flow cooling device 10 thermally connected with a component comprises the heat mass 20; an arm 19 extending outward in contact with the heat mass 20; a wing 23 connected with a rib 21 extending downward from the arm and extending outward therefrom; and a plurality of fins 30 which are nearly aligned with a longitudinal axis of the heat mass and connected with an upper face of the heat mass and upper and lower faces of the arm. End edges facing each other which form a first and second side faces 2 and 4 of the side flow cooling device are included, and a slot is formed between the fins with a space. An air flow flowing into the first or second side face wets over mutually facing cooling surfaces 30s and the heat mass through the slots to dissipate heat. COPYRIGHT: (C)2004,JPO |
