| 摘要 |
PROBLEM TO BE SOLVED: To provide a metal base wiring board in which the thickness of an insulating layer of a strip line formed by a surface conductor pattern can be thinned, the entire thickness can be prevented from becoming thick, a GND surface rigid in high frequency can be obtained on the surface conductor pattern, and the degree of freedom in design of a wiring pattern can be obtained, and to provide a high-frequency device using this board. SOLUTION: A metal base 1 has an engraved portion 2, the portion 2 is filled with an insulator 3, copper plating is performed on the surfaces of the insulator and the metal base, and a first conductor pattern 4 having a desired pattern is formed by etching. A single-sided copper foil substrate 6 is stuck on the entire top surface of the metal base including the engraved portion. A second conductor pattern 7 is formed on the copper foil of the substrate 6, and the pattern 7 is connected to a chip component 8. COPYRIGHT: (C)2004,JPO |
