发明名称 PRINTED WIRING BOARD FOR HIGH-SPEED SIGNAL USING SLIT METHOD
摘要 PROBLEM TO BE SOLVED: To provide a printed wiring board for a high-speed signal, using a slit method which is suitable for high-speed signal transmission and is particularly capable of controlling the characteristic impedance of the transmission line, without changing the resistance or the inductance thereof. SOLUTION: The printed wiring board 1 for the high-speed signal, using the slit method in two layer wiring has the transmission line comprising a signal line 10, a flat-plate shaped dielectric 11, a ground plane 12, and a slit 13. COPYRIGHT: (C)2004,JPO
申请公布号 JP2004140308(A) 申请公布日期 2004.05.13
申请号 JP20020337298 申请日期 2002.10.16
申请人 ADORINKUSU:KK 发明人 ARISAKA HIROSHI
分类号 H05K1/02;(IPC1-7):H05K1/02 主分类号 H05K1/02
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