HEAT-RESISTANT ADHESIVE COMPOSITION, LAMINATE USING THE SAME AND FLEXIBLE PRINTED BOARD

摘要

PROBLEM TO BE SOLVED: To provide a low-cost heat-resistant adhesive composition having high heat resistance and high pressure resistance while having sufficient mechanical strength, adhesive strength and film formability, and capable of being processed at comparatively low temperature. SOLUTION: The heat-resistant adhesive composition comprises (A) a thermoplastic resin having at least one imide group, (B) a thermosetting compound having at least two maleimide groups and (C) a compound having a functional group reactive with the component (B). COPYRIGHT: (C)2004,JPO